Qualcomm RB3 Gen 2 Development Kit (Core Kit)
Thundercomm / Qualcomm · Maglev ID cm-qualcomm-rb3-gen2-devkit
US Maker in United States, factory not confirmed unknown VERIFIED
Qualcomm's QCS6490 robotics/IoT reference kit built by Thundercomm, for evaluating a 12 TOPS Qualcomm edge-AI design.
Specifications
| SoC | Qualcomm QCS6490 (octa-core, Adreno 643 GPU) |
|---|---|
| AI performance | 12 TOPS |
| RAM | 6 GB LPDDR4x (uMCP) |
| Form factor | Dev board following 96Boards spec; 128 GB UFS, microSD, PCIe |
| Operating temp | unknown |
Who makes it
MakerThundercomm
Based inUnited States
RoleBrand owner
Need a different shaft, connector, firmware or enclosure, or a price at 1,000 units? Maglev takes the catalog part to the factory and comes back with a custom version and one fixed price.
Landed cost in the US
CN
25%+?
TW
0%+?
VN
0%+?
IN
0%+?
JP
0%+?
KR
0%+?
DE
0%+?
MX
0%+?
US
0%
Total US duty on this part by where it is made (2026-10-29). Mexico shown before USMCA preference; qualifying goods enter duty free. Your factory choice, not the shipping port, sets the origin.
Loading duty data…
Compliance
| HTS classification | 8473.30.11.80 typical, not a ruling |
|---|---|
| NDAA | unknown |
| Blue UAS | unknown |
| FCC | unknown |
Sources
- https://www.thundercomm.com/product/qualcomm-rb3-gen-2specs + Core/Vision kit prices
Record confidence: VERIFIED. VERIFIED means the maker's own documents; REPORTED means a credible third party; UNVERIFIED means a single weak source. Anything we could not confirm says unknown.